Samsung Electronics today unveiled a range of new chipsets that will be embedded into the company’s next generation 5G solutions. The new 3GPP Rel.16 compliant chipsets consist of a third generation mmWave Radio Frequency Integrated Circuit (RFIC) chip, a second generation 5G modem System-on-Chip (SoC) and a Digital Front End (DFE)-RFIC integrated chip. The company’s latest chips will power Samsung’s next-generation products for 5G build out, including the next generation 5G Compact Macro, Massive MIMO radios and baseband units, which will all be commercially available in 2022.
The new chipsets were announced today at “Samsung Networks: Redefined,” the company’s virtual public event highlighting notable 5G accomplishments and new solutions for network transformation. At the event, Samsung emphasized its experience in developing in-house chipsets for more than two decades and reiterated the significant investments behind the launch of multiple generations of chipsets starting from 3G, leading to today’s cutting-edge 5G solutions.
The newly introduced chipsets are designed to take Samsung’s next generation 5G lineup to a new level, boosting performance, increasing power efficiency and reducing the size of the 5G solutions.
Samsung’s newly-introduced chips are:
“This newly unveiled chipset is the fundamental component of our state-of-art 5G solutions, developed through a long-standing R&D effort that enables Samsung to be at the forefront of delivering cutting-edge 5G technologies,” said Junehee Lee, Executive Vice President and Head of R&D, Networks Business at Samsung Electronics. “As one of the largest semiconductor companies in the world, we are committed to developing the most innovative chips for the next phase of 5G advancement, integrated with the features mobile operators seek to stay competitive.”
“5G chipsets are critical to achieving the performance capabilities required for next-generation network deployments,” stated Anshel Sag, Moor Insights & Strategy. “Samsung’s long-standing expertise in developing chipsets in-house is a key differentiator, positioning it as a leader in the delivery of 5G network solutions with the features and benefits operators seek to advance their 5G strategies.”
Samsung has pioneered the successful delivery of 5G end-to-end solutions including chipsets, radios, and core. This includes the creation and shipment of innovative chips from Samsung’s manufacturing facility in Austin, Texas. Through ongoing research and development, Samsung drives the industry to advance 5G networks with its market-leading product portfolio from fully virtualized RAN and Core to private network solutions and AI-powered automation tools. The company is currently providing network solutions to mobile operators that deliver connectivity to hundreds of millions of users around the world.
: